Specs below are from vendor materials and reputable technical references accessed September 11 and October 10, 2026. Treat them as planning inputs, not provider proposals. Conflicting public figures (especially early Blackwell memory marketing) should be verified against the exact SKU and form factor you will buy or rent.
NVIDIA (Ampere → Hopper → Blackwell)
| GPU / system |
Architecture theme |
Memory (published) |
Memory bandwidth (published) |
Mid-market role |
| A100 |
Ampere |
80 GB HBM2e |
~2.0 TB/s (SXM class) |
Proven training/fine-tune baseline |
| H100 |
Hopper |
80 GB HBM3 (SXM) |
~3.0–3.35 TB/s |
Workhorse training & general AI |
| H200 |
Hopper + HBM3e |
141 GB HBM3e |
4.8 TB/s |
Memory-bound inference on Hopper |
| B200 |
Blackwell |
180 GB HBM3e (NVIDIA HGX/DGX materials) |
Up to 8 TB/s |
Flagship single-GPU Blackwell |
| GB200 Superchip |
Grace + Blackwell |
CPU+GPU memory complex (Grace LPDDR + Blackwell HBM) |
Fabric-dependent |
CPU–GPU tightly coupled nodes |
| GB200 NVL72 |
Rack-scale NVLink domain |
HBM3E pooled across 72 Blackwell GPUs |
Rack-scale NVLink fabric |
Large-model training / high-throughput inference |
| DGX B200 |
Eight-GPU Blackwell system |
1,440 GB total GPU memory (NVIDIA) |
Up to 64 TB/s aggregate HBM bandwidth |
Turnkey multi-GPU enterprise node |
| DGX Vera Rubin NVL72 |
Next-gen rack path |
HBM4 across 72 Rubin GPUs (preliminary) |
Not yet final, per NVIDIA |
Forward-looking rack planning only |
AMD Instinct (CDNA 3 → CDNA 4 → CDNA 5)
| GPU |
Architecture theme |
Memory (published) |
Memory bandwidth (published) |
Mid-market role |
| MI300X |
CDNA 3 |
192 GB HBM3 |
5.3 TB/s |
Memory-led inference / large-model fit |
| MI325X |
CDNA 3 |
256 GB HBM3E |
6 TB/s |
Higher-capacity CDNA 3 platform |
| MI350P |
CDNA 4 |
144 GB HBM3E |
4 TB/s |
PCIe path into existing servers |
| MI350X |
CDNA 4 |
288 GB HBM3E |
8 TB/s |
High-capacity OAM training/inference |
| MI355X |
CDNA 4 |
288 GB HBM3E |
8 TB/s |
Higher-power CDNA 4 flagship in series |
| MI430X |
CDNA 5 (announced) |
HBM4 |
Not listed in AMD series overview |
Cost-optimized MI400-class (roadmap) |
| MI455X |
CDNA 5 (launched July 23, 2026) |
432 GB HBM4 |
23.3 TB/s |
Flagship MI400 / Helios rack-scale path |
The AMD Instinct MI300 Series page confirms MI300X (192 GB / 5.3 TB/s) and MI325X (256 GB / 6 TB/s). The AMD Instinct MI350 Series page confirms MI350P at 144 GB / 4 TB/s. MI350X and MI355X list 288 GB HBM3E at 8 TB/s. The AMD Instinct MI455X page lists 432 GB HBM4 at 23.3 TB/s. It also lists a July 23, 2026 launch date. MI430X also uses HBM4. Confirm shippable MI400-series configurations in provider proposals.
Reading the table for mid-market AI teams: AMD’s published Instinct SKUs often emphasize larger HBM per GPU than same-era NVIDIA cards (for example MI300X 192 GB vs H100 80 GB; MI325X 256 GB vs H200 141 GB; MI350X 288 GB vs B200 180 GB in AMD’s own comparisons). NVIDIA’s advantage is less about winning every memory column and more about software maturity, interconnect ecosystem depth, and breadth of validated deployments. Neither column alone decides the deal.